3DE10
Print then Pick-and-Place SMDs directly on fully 3D substrates
Replace all your PCBs from your device with 3D Printed Structural Electronics
Enter into the revolution of 3D Electronics :
The 3DE10 delivers 3D structural Printed Electronics revolutionizing the integration of electronics directly into your devices. This single machine, the 3DE10, replaces standard planar circuit manufacturing, by direct integration of your electronics into or onto your 3D device:
- Direct-to-Shape printing of functional inks such as interconnected traces and IC’s soldering glue
- Direct-to-Shape Pick-and-Place of SMD components, bonding and final attachment
This innovation results from an unprecedented combination of innovative processes and full featured software offering unparalleled functionalities, precision and flexibility.
Functional inks direct printing
The 3DE10 is fitted with an advanced head, capable of printing conductive, semi-conductive and dielectric inks on three-dimensional substrates with micron-level precision. This feature allows for the production of complex interconnects circuits directly on 3D parts.
Components 3D Pick-and-Place
The 3DE10 performs the pick-and-place operations of SMD electronics, encapsulated or bare die, with great precision and seamless integration, directly on to the printed 3D device.
Integrated Software
- A user-friendly software drives you naturally into the process of designing the schematics then place and route electronics in 3D, directly on your specific device’s shape
- An intuitive user interface guide you into precise control over all manufacturing aspects
- Seamlessly monitor and adjust parameters in real-time
- Automate the various steps of production
