Roll to roll assembly enables mass production of IoT devices such as RFID tags, medical devices and traceability devices for logistics or for food industries.

The DPP320-R performs numerous functions on roll-to-roll substrates:

• Glue patterning, protective conformal selective coating, and globe-top
• CMS components or bare die chips assembly
• Chip programming via electrical radio connexion
• Component testing, typically via UHF RFID, NFC, or Bluetooth transmission
• Conductive tracks printing

Here are some of the benefits of continuous assembly of electronic components on flex substrates:

• High efficiency: The continuous assembly process can be used to assemble a large number of components in a short amount of time.
• Cost-effective: The continuous assembly process is a relatively low-cost manufacturing method.
• Flexibility: The continuous assembly process can be used to assemble a wide variety of components.
• Quality: The continuous assembly process can produce high-quality electronic devices.